View the Hamilton Heating Cooling Module

Precision Heating and Cooling

The Heating Cooling Module is a small liquid handling device that offers wide-ranging and precise temperature control for ANSI/SLAS footprint microplates. Integrated in an automated workflow with a Hamilton liquid handling platform, the Heating Cooling Module maximizes walkaway time. Additionally, the Heating Cooling Module functions as a standalone device. For optimal efficiency, integrate two Heating Cooling Modules per Multiflex carrier base.

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Features and Benefits

Simplified Control

The Heating Cooling Module is controlled through a simple interface on the device or through Hamilton software when integrated with a Hamilton liquid handling platform.

Broad Functionality

Precise temperature control ranges from 4°C to 95°C. Additionally, plate loading and unloading may be automated or performed manually.

Additional Resources for the Heating Cooling Module

See all Small Liquid Handling Devices
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