Precision Heating and Cooling
The Heating Cooling Module is a small liquid handling device that offers wide-ranging and precise temperature control for ANSI/SLAS footprint microplates. Integrated in an automated workflow with a Hamilton liquid handling platform, the Heating Cooling Module maximizes walkaway time. Additionally, the Heating Cooling Module functions as a standalone device. For optimal efficiency, integrate two Heating Cooling Modules per Multiflex carrier base.
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