Hamilton Heating Cooling Module

Precision Heating and Cooling
The Heating Cooling Module is a small liquid handling device that offers wide-ranging and precise temperature control for ANSI/SLAS footprint microplates. Integrated in an automated workflow with a Hamilton liquid handling platform, the Heating Cooling Module maximizes walkaway time. For optimal efficiency, integrate two Heating Cooling Modules per Multiflex carrier base.
Features and Benefits
Simplified Control
Broad Functionality
Additional Resources for the Heating Cooling Module
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