Precision Heating and Cooling

The Heating Cooling Module is a small liquid handling device that offers wide-ranging and precise temperature control for ANSI/SLAS footprint microplates. Integrated in an automated workflow with a Hamilton liquid handling platform, the Heating Cooling Module maximizes walkaway time. For optimal efficiency, integrate two Heating Cooling Modules per Multiflex carrier base.

Features and Benefits

Simplified Control

The Heating Cooling Module is controlled through a simple interface on the device or through Hamilton software when integrated with a Hamilton liquid handling platform.

Broad Functionality

Precise temperature control ranges from 4°C to 95°C. Additionally, plate loading and unloading may be automated or performed manually.

Additional Resources for the Heating Cooling Module

See all Small Liquid Handling Devices
Explore the On-Deck Thermal Cycler
Check out the Hamilton Heater Cooler
See the Hamilton Incubator Shaker
View the Hamilton Heater Shaker
See the Hamilton Heater Cooler

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